Follow up re: Counterfeit Microelectronic Parts and Inspections & Tests That Reveal Them

In an earlier post, I describe how inspection and test protocols should be designed to reveal the more insidious varieties of counterfeit and fraudulent parts circulating throughout the open market.

The following paper is an example of this sort of approach….

Screening for Counterfeit Electronic Parts, B. Sood, D. Das and M. Pecht, Journal of Materials Science: Materials in Electronics, Vol. 22, No. 10, pp. 1511-1522, 2011.

As industry, the US Government and standards organizations improve authenticity verification approaches, the design of test and inspection protocols should seek to reveal failure mechanisms induced by exposure to conditions used parts are subjected to during counterfeiting operations such as excessive heat, moisture, contaminants, electrostatic discharge and the combinational effects of these exposures.

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